Stone wire saws need to adapt to the cutting requirements of ultra-large sizes, different materials, and varying hardness of raw blocks, placing far higher demands on equipment stability, cutting efficiency, and cost control than in the photovoltaic industry. For example, traditional photovoltaic wire saws use thinner diamond wires (0.1-0.2mm), while stone wire saws require thicker diamond wires (e.g., 0.45mm) to handle high-intensity cutting. Furthermore, existing diamond wire saws primarily process smaller objects such as silicon wafers, magnetic materials, and optical glass, with the vast majority of processing dimensions below 300mm. In contrast, the processing of large slabs of natural stone often requires the ability to process slabs up to 3000mm × 2000mm.
Meanwhile, silicon wafer cutting uses diamond wires with diameters of 0.035~0.07mm, tension controlled at 4~9N, and a cutting thickness of only or less than 0.2mm, cutting over 2000 pieces at a time. Natural stone, on the other hand, typically exceeds 1500mm × 2500mm × 1500mm in length, width, and height, and weighs over 20 tons. Traditional equipment can process stones up to 3000mm×2000mm×2000mm in size, with a thickness typically between 15 and 25mm, cutting 80 to 120 pieces at a time. Therefore, diamond wire multi-wire cutting of stone requires specific modifications tailored to the characteristics of the stone. For example, to ensure the strength of the diamond wire, which has a large span, the wire needs to be thickened to increase tension during cutting and reduce breakage. The processing stroke needs to be increased, limiting the number of pieces cut at one time to 50 to 120. The cutting thickness also needs to be increased, among other things, to meet the needs of the stone industry.
